STMicroelectronics MJ3001 Replacement Parts & Analogues
The information presented on our web-site is based on our best estimate of other manufacturers' published information at the time that we collected this information. The design originated at around 1955. . If you do not have an account yet, please apply here and get direct access to specialist engineers. For example component has more functionality. Our project is not responsible for any incorrect or incomplete information. We recommend that you completely review all available fresh datasheet to confirm the device functionality, pinout, and performance for your application.
Compatible Equivalent - The body and the findings coincide. The lead spacing was originally intended to allow plugging the device into a then-common. Insulating washers may be made of or other materials with good. The case surfaces are metal for good heat conductivity and durability. The spacing and dimensions of the case leads make it unsuitable for higher frequency radio frequency devices.
This information is for suggestion purposes only. Possible Analog - Information on this component is not confirmed. Pin to Pin Replacement - Match Corps, functional and electrical characteristics. The information presented on our web-site is based on our best estimate of other manufacturers' published information at the time that we collected this information. Let them help you identify product alternatives, source additional technical data and find answers to your technical questions. Some items are non-cancellable and non-returnable.
Substitute can be done without amending the existing electrical wiring diagram. The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. This information is for suggestion purposes only. The metal-to-metal and metal-to-glass joints provide that protect the semiconductor from liquids and gases. Please contact our Sales Team 03447 11 11 11. The metal case is connected to the internal device and the leads are connected to the die with bonding wires. Since the device case is one of the electrical connections, an may be required to electrically isolate the component from the heatsink.
Our project is not responsible for any incorrect or incomplete information. The leads pass through the metal base plate and are sealed with glass. Functional Equivalent - possible replacement to the change in the printed circuit board. We recommend that you completely review all available fresh datasheet to confirm the device functionality, pinout, and performance for your application. To be accepted for return on this basis, Goods should be returned for receipt by the Company within 21 days of despatch.
